Advanced PCB Manufacturing Solutions
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Single to Multi-Layer Rigid PCBs
High-density interconnects (HDI) and multi-layer boards designed for maximum reliability in extreme industrial environments.
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Advanced Flex Circuits
Dynamic flexible and rigid-flex configurations for space-constrained applications, ensuring high electrical performance.
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Prototype to Scale
Empowering product development with fast-turn prototyping followed by seamless transition to high-volume manufacturing.
Products Showcase
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1L & 2L NPTH & STH –CEM1 Material
2L & Multilayers in HAL Pb Free
1L & 2L ALUMINUM Base up to 3mm Thick
2L & MULTILAYER FLEXI RIGID & 1 or 2L Flexibles
2L & Multilayers to18 Layers, HDI in NiAu, Ag or Sn
SPECIAL MATERIALS –Arlon, Rogers Etc
PCB Capability
Attribute / Board Type
Single Sided / STH
Flex Board
Rigid Flex
Double Sided
Multilayers (4-18L)
HDI (Prod)
HDI CapabilityÂ
Layers
1L
1-6L
2-12L
2L
4-18L
1+N+1 (N=2-8)
3+N+3 (N=2-8)
Material Type
CEM-1, FR-1, FR-2, CEM-3, FR-4, Aluminum PCB
PI, PET
PI, PET, FR-4, High TG FR-4, Halogen Free FR-4, High Thermal Conductive material, High Frequency Material
FR-4, High TG FR-4, Halogen Free FR-4, High Thermal, High Frequency, Embedded Capacitor & Resistor
FR-4, High TG FR-4, Halogen Free FR-4, High Thermal, High Frequency, Embedded Capacitor & Resistor
FR-4, High TG FR-4, Halogen Free FR-4, High Thermal, High Frequency, Embedded Capacitor & Resistor
FR-4, High TG FR-4, Halogen Free FR-4, High Thermal, High Frequency, Embedded Capacitor & Resistor
Min. hole size
0.7mm by punching
0.3mm by CNC
0.2mm
0.2mm
0.2mm
0.15mm
Laser blind 0.1mm
Laser blind 0.1mm
Min Track & Gap
D/F 0.1/0.1mm
0.075/0.075mm
0.075/0.075mm
PCB Thickness
0.5-2mm
≥0.05mm
0.25-3mm
0.4-3.2mm
0.4-3.2mm
0.4-3.2mm
0.4-3.2mm
PCB Finish
LF-HASL /ENIG/OSP
Gold plate/ENG/OSP
HASL / ENIG /Gold Plate + OSP
Facilities Quality Approval
UL
ISO 9001
ISO 14001
TS 16949
RoHS
